신뢰성 테스트

전자제품 납품시 신뢰성 테스트(Reliability Test)를 수행 후 기능 검증이 되어야 한다.

부품이 특정 시간동안 여러가지 상황(고온, 고습, 저온, 저습, 오버 전류 등등)에 노출된 이후에도 부품이 정상 동작해야 한다.

당연히 신뢰성 테스트 항목은 국제표준(www.jedec.org)에 요인한다. 

테스트 항목

1. High Temperature Operating Life (HTOL)
• 참조문서: JESD22-A108
• This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. 
2. Temperature Humidity with Bias (THB)*
• 참조문서: JESD22-A101
• This test is performed for the purpose of evaluating the reliability of non-hermetic packaged solidstate devices in humid environments. It employs conditions of temperature, humidity, and bias which accelerate the penetration of moisture through the external protective material or along the interface between the external protective material and the metallic conductors which pass through it
3. Temperature Cycle (TC)* 
• 참조문서: JESD22-A104
• This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.
4. High Temperature Storage (HTS)
• 참조문서: JESD22-A103
• High Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). 
5. Low Temperature storage (LTS) 
• 참조문서: EIAJ ED-4701/200
• Low Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices, including nonvolatile memory devices (data retention failure mechanisms). 
6. Autoclave (Pressure Cooker Test : PCT)*
• 참조문서: JESD22-A102
• This test is performed to evaluate the moisture resistance integrity of non-hermetic packaged solid state devices using moisture condensing or moisture saturated steam environments. It is a highly accelerated test which employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material or along the interface between the external protective material and the metallic conductors passing through it.
7. Human Body Model (HBM)
• 참조문서: JESD22-A114
• The human-body model (HBM) is the most commonly used model for characterizing the susceptibility of an electronic device to damage from electrostatic discharge (ESD). The model is a simulation of the discharge which might occur when a human touches an electronic device.
8. Machine Model (MM)
• 참조문서: JESD22-A115
• This test is classifying microcircuits according to their susceptibility to damage or degradation by exposure to a defined electrostatic Machine Model (MM) discharge (ESD).
9. Charged Device Model (CDM) 
• 참조문서: JESD22-A101
• The charged-device model (CDM) is a model for characterizing the susceptibility of an electronic device to damage from electrostatic discharge (ESD).
10. Latch-up 
• 참조문서: JESD78
• This test is to evaluate latch-up characteristics for NMOS, CMOS, bipolar, and all variations and combinations of these technologies.
11. Preconditioning Test
• 참조문서: JESD22-A113

* 항목은 pre-conditioning이 필요없는 항목이다.